Поставка оптоэлектронных компонентов ведущих мировых производителей

Non-contact 3D Form/Shape Measurement Equipment for Aspheric, Freeform Optics & Lens Mold Measurement The LUPHOScan HD non-contact 3D optical profilometer/equipment delivers the highest accuracy for radius and irregularity on challenging surfaces such as high departure aspheres and freeforms. The industry-leading stability guarantees accuracy even in the most challenging environments and provides fast measurement cycle times with no loss in accuracy. The next generation 3D profilometer/equipment provides an industry first with instrument accuracy better than ±50 nm (3σ) on sample slopes up to 90°. The LUPHOScan HD platforms are interferometric, scanning metrology systems based on MWLI® technology (multi-wavelength interferometry). They are designed to perform ultra precision non-contact 3D form measurements of rotationally symmetric surfaces such as aspheric lenses, spheres, flats and freeforms. Key benefits of the LUPHOScan HD include fast measurement speeds, high flexibility with regard to uncommon surface shapes (e.g. flat apexes or profiles with points of inflection), and maximum object diameters up to 420 mm. Revolutionary measurement and analysis capability •Analysis of any rotationally symmetric surface — Aspheres, spheres, flats and freeforms •Highest accuracy on object slopes up to 90° — Ideal for measuring strong, steep, and small aspheres including cell phone lens moulds •Measurement of almost any material — Transparent, specular, opaque, polished, ground •Large spherical departures — Measure pancake or gullwing surfaces and profiles with points of inflection

Технические характеристики

CharacteristicsTechnologyoptical, 3DFunctionsurface flatness, shape measurementOther characteristicsnon-contact

LUPHOScan 260/420 HD Non-contact profilometer LUPHOScan 260/420 HDoptical3Dsurface flatness — товар из ассортимента Laserzz для подбора и поставки под задачи ремонта и комплектации.

Позиция подходит для сценариев замены и закупки под конкретную спецификацию оборудования.

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Вопросы и ответы

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