The Leica EM TXP is a target preparation device for milling, sawing, grinding, and polishing samples prior to examination by SEM, TEM, and LM techniques. An integrated stereomicroscope allows pinpointing and easy preparation of barely visible targets. With the specimen pivot arm the sample can be observed directly at an angle between 0° and 60°, or 90° to the front face for distance determination with an eyepiece graticule. Key Features Integrated automatic process control Integrated process control with automatic E-W guiding mechanism, force-regulated feed control and countdown function saves the user from time-consuming routine sample preparation. Surface finish and target examination Surface finish and target examination with the integrated stereomicroscope means that the user does not have to transfer the sample for distance estimation and surface evaluation, which increases user efficiency. Variety of tool inserts Variety of tool inserts allows the specimen to be milled, sawed, drilled, ground and polished without sample removal from the instrument. The ability to observe the process through the stereomicroscope results in time and cost savings. Inspection of Multilayer Samples Workflow in Quality Control: Combining the target surfacing system Leica EM TXP and the light microscope Leica DM2700 M allows to reduce the required procedure, streamline the workflow and produce reliable and precise results.
Технические характеристики
CharacteristicsOperationautomaticApplicationsfor SEM
