Bonded semiconductor shaving tool USE : CWB/18-60 tool enables the user to remove the bonded semiconductor while making a chamfer in a clean and swift manner on the transition. SPECIFICATIONS : Capacity : Ø 18 to 60 mm onto the semiconductor Cutting depth : from 0.4 mm to 1.1 mm (1,8 mm max for CWB/18-60-FEP) Chamfer angle : 8° (13° for CWB/18-60-FEP) Remaining length of semiconductor : 25 / 30 / 40 mm ADVANTAGES : Removal of the bonded semiconductor without requiring lubricant. Very smooth finish on the insulation.
Технические характеристики
CharacteristicsProduct to be strippedfor electrical cablesDiameter
Min.: 18 mm (0.71 in)
Max.: 60 mm (2.36 in)
