The module is intended especially for instrument construction. It is delivered in the form of a fitted plate for brazing into the user´s printed circuit by means of gilded pins which also serve for electric connection. The plate itself is varnished but has neither electric nor mechanical cover and thus protection of the final product construction is supposed. At this type of module, pressure is measured by means of a sensor with a silicon membrane, the measuring principle is piezoelectric. Thanks to this, the module achieves high overload capacity, it is resistant against vibrations and can work in any position. Ann undisputable advantage for some applications is the possibility of measuring both underpressure and overpressure by one module. The electronics is realized by surface mounting technology.
Технические характеристики
CharacteristicsPressure typedifferentialTechnologypiezoresistive, piezoelectricOutputanalogMountingSMDApplicationsfor HVAC systems, for clean rooms, for OEM, processOther characteristicsOEM, temperature-compensated, low pressure, economical, miniaturePressure range
Min.: 50 Pa (0.01 psi)
Max.: 100,000 Pa (14.5 psi)
Process temperature
Min.: -20 °C (-4 °F)
Max.: 85 °C (185 °F)
