High density lightweight I/O connector Optimized design and composite or aluminum shell for weight saving / 65% weight saving compared to standard HD D-Sub Miniature solution for maximum space saving on panel / 35% size saving compared to standard HD D-Sub Ease of use : removable & protected contacts, easy mating / unmating / 38 % easier than standard HD D-Sub with 33% more contacts Non magnetic, non outgassing ESCC 3401 QPL Miniature Space Grade microComp® Series is a QPL rectangular interconnect solution based on ESCC 3401 design. Very High Density from 7 to 104 ways #26 contacts, up to 2,5 A each crimp & straight or 90° PC tail contacts High speed network for Cat 5e Gigabit Ethernet 1000 base T links QPL on ESCC 3401/081, 3401/082, 3401/083, 3401/084
Технические характеристики
CharacteristicsTypedataFormatEthernet, D-subShaperectangular, straightElectrical characteristicshigh-density, high-speedMaterialaluminum, composite, shellDomainnetworkOther characteristicsminiature, high-speed, lightweightOperating temperature
Min.: -55 °C (-67 °F)
Max.: 175 °C (347 °F)
