This new design of the non–inductive thick film Metal Oxide Technology with the wire terminals eliminates the possibility for problems regarding creeping distance from terminal to ground. Best results can be reached by using a thermal transfer compound with a heat conductivity of better than 1W/mK. The flatness of the cooling plate must be better than 0.05mm overall. The roughness of the surface should not exceed 6.4µm. Applications： This unique design will allow you to use this element in the following areas:Variable Speed Drives, Power Supplies, Control Devices, Telecommunications, Robotics, Motor Controls and other Switching Devices.
Технические характеристики
CharacteristicsTechnologythick-filmElectrical characteristicsvariableMountingboard-mountApplicationsfor electronics, for telecom applicationsResistance
Max.: 1,000,000 Ohm
Min.: 1 Ohm
Power rating
100 W
