pitch (mm): 0.75 x 0.875 (staggered) Number of contacts: 100, 200, 300 Rated voltage: AC50V Current rating (Amps): 1 Stacking height (mm): 14 — 40 Mating style: Parallel Assembly style: BGA (Ball Grid Array) Notes: High speed transmission (10+ Gbps) Self-alignment (large x/y axis tolerance) due to 3-piece design
Технические характеристики
CharacteristicsFormatSMT, mezzanineShapeparallelProduct applicationsboardPrimary current
1 A
Voltage
50 V
Data rate
10 GB/s
