Технические характеристики
| Name: | Unicomp X-ray Inspection Machine | Application: | SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor |
|---|---|---|---|
| Tube Voltage: | 80KV/90KV | Industry: | Electronics Industry |
| Size: | 1100(L)x1100(W)x1500(H)mm | X-ray Leakage: | |
| Weight: | 1000kg | Power Consumption: | 0.8KW |
| High Light: | Bond Wire Unicomp X Ray machine, High Resolution Unicomp X Ray machine, PCBA X ray Inspection Machine |
