Технические характеристики
| Name: | BGA X Ray Inspection Machine | Application: | SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor |
|---|---|---|---|
| Max.Power: | 8W | X-ray Leakage: | |
| Monitor: | 22’LCD | Power Consumption: | 0.8kW |
| High Light: | bga x ray inspection system, bga x ray machine |
