Технические характеристики
| Name: | Electronics X Ray Machine | Application: | SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor |
|---|---|---|---|
| X-ray Coverage: | 48mm X 54mm | X-ray Leakage: | |
| Weight: | 300kg | Power Consumption: | 0.5kW |
| High Light: | BGA CSP Electronics X Ray Machine, 0.5kW Electronics X Ray Machine, 100kV X Ray Inspection Equipment |
