One component, nanosilica filled, dual cure system with UV and heat curing mechanisms Key Features — Thixotropic paste — Minimal shrinkage upon curing — Low coefficient of expansion — Cures in shadowed out areas at 80°C Master Bond UV22DC80ND is a nanosilica filled, UV dual cure system. The secondary cure is accomplished by adding heat, with the minimum temperature being 80°C. Essentially, this epoxy based system will cure readily upon exposure to UV light and if there are any shadowed out areas, heating at 80°C will complete the cure. The 80°C curing feature is particularly useful given the sensitivity of many plastics to elevated temperatures. The consistency of UV22DC80ND can best be described as a thixotropic paste. It dispenses readily, but has limited flow. This UV is a cationic type cure and is not oxygen inhibited. It bonds well to a wide variety of substrates including metals, glass, ceramics and most plastics. UV22DC80ND has very good chemical resistance to many acids, bases, fuels and solvents. It is a superb electrical insulator and it is also able to withstand rigorous thermal cycling. The service temperature range is -60°F to +350°F. As a nanosilica filled system, it has exceptionally low shrinkage upon curing and stellar dimensionally stability.
Технические характеристики
CharacteristicsChemical compositionepoxyType of substratefor metal, for plastics, glass, for ceramicsNumber of componentssingle-componentTechnical characteristicsheat-cured, dual-curing, electrically insulating, chemical-resistantApplicationsfor electronics, for OEM, optical, for the aerospace industryWorking temperature
Max.: 350 °F (176.67 °C)
Min.: -60 °F (-51.11 °C)
