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Electrally/Thermally Conductive (ETC) epoxy adhesives provide solutions to a variety of electrical, electronic, and thermal design problems throughout the laboratories and industries.
Properties Electrically/Thermally Conductive Product Number 525 556 597A 598FS 568 805 860 Filler Silver Silver Silver Nickel Aluminum
Aluminium Aluminium Nitride Mix Ratio by Weight: Resin : Hardener NA 1:1 NA NA 1:1 100:12 1:1 Mixes Specific Gravity, g/cc @ 25°C 1.85 2.8 2.3/2.1 2.87/1.5 0.85 1.66 1.9 Mixes Viscosity, @ 25°C, cps Paste Paste Paste/Paste Paste/480 Paste 85,000 Paste Pot Life, 100g mass @ 25°C, hrs. N/A 1 N/A N/A 4.0 ≤1.0
4.0 Recommended Cure, hr/°F 2/300 24/RT 2/RT+2/200 2RT+2/200 2/200 2/100+2/200
2/200
Alternative Cure, hr/°F 6/250 4/170 or 2/210 — — 24-48/RT 24-48/RT
24-48/RT
Temperature Resistance, °F (°C) 340 (171) 340 (171) 1200 (649) 1000 (538) 400 (204 572 (300) 400 (204) CTE, in/in/°F x 106 (°C) 29.0 (52.2) 13.9 (25.0) 9.6 (17.3) 6.5 (11.7) 33.0 (60.0) 25.0 (45.0) 18.7 (33.3) Thermal Conductivity, Btu-in/hr-ft2-°F 62.2 65.0 63.1 17.9 9.0 12.5 8.5 Tensile Shear Strength, psi * 2,500 1,500 — — 1,400 1,200 1,375 Volume Resistivity, ohm-cm 0.01 0.0052 0.0002 0.005 1.0 x 105 1.0 x 1014 1.0 x 1014 Dielectric Strength, volts/mil – – – – 80 50 250 Chemical Resistance Excellent Excellent Excellent Excellent Excellent
Good Excellent Colour Silver Silver Silver Dark Gray Grey Grey Grey
Store at room temperature
Application Notes:
Surface Preparation: All surfaces must be free of oil, dirt, corrosives, oxides, paint or other foreign matter.
Mixing: Two-component products should be mixed thoroughly to a uniform consistency. Preheat high viscosity epoxies to approximately 125°F to facilitate pouring and mixing.
Application: In most cases, the adhesive should be applied to both surfaces maintaining a glue line of less than 10 mils (25.4 µm). After assembling the parts, pressure should be applied to the assembly to prevent warpage and reduce air entrapment. Refer to curing guidelines in above property chart.
Technical Data Sheet
Technical Data Sheet 598
Technical Data Sheet 860
ETC Bond 525 – Electrically conductive, silver filled, one-part epoxy paste. Good chemical resistance and mechanical strength to 340°F. SDS
ETC Bond 556 – Electrically conductive. Silver filled, 1:1 Epoxy paste. Good corrosion resistance and mechanical strength to 340°F. SDS Part A — Activator SDS Part B — base Resin
ETC Bond 597A – Electrically and thermally conductive. Silver filled. One part system. Inorganic system for bonding applications up to 1200°F.
ETC Bond 598FS – Electrically and thermally conductive. Nickel filled. One part system. Low viscosity. For applications up to 1000°F. SDS
ETC Bond 568 – Thermally conductive. Aluminum filled, 1:1 epoxy paste. Excellent mechanical strength to 400°F. SDS Part A — Activator SDS Part B — Base Resin
ETC Bond 805 – Thermally conductive. Aluminum filled. Two part epoxy paste. Low shrink rate. Excellent mechanical strength to 570°F. SDS Part A — Activator SDS Part B — Base Resin
ETC Bond 860 – Thermally conductive. Aluminum nitride filled. 1:1 epoxy paste. Excellent mechanical & thermal properties to 400°F. SDS Part A — Activator SDS Part B — Base Resin
Технические характеристики
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