The printed front &rear contacts are fired into the PN junction layer to form an ohmic contact through firing process,which allows the electrical energy collected by the fingers to flow out through the busbars. · Dual-track production line, the rack and electrical parts completely independent without interfering operations of each other. · CT≤0.95s. · High throughput: actual throughput up to 175,000 pcs/day. · A grade wafers, mono breakage rate 0.03%.
Технические характеристики
CharacteristicsConfigurationchamber, conveyorHeat sourceelectricOther characteristicscontinuous, horizontal
