Guided rework with high-performance optical system and flexible heating technology Thanks to guided processes, the Ersa Rework System HR 550 ensures safe rework on the basis of simple and convenient operation. Predicate: visually leading! The Technology of the Ersa Rework Systems sustainably secures the added value of electronics: • gentle heating technology • sensor guided soldering processes • contactless residual solder removal • precise component placement • complete process documentation • clear user guidance • Highly efficient 1,800 W hybrid heating head • Large-area IR bottom heating in 3 heating zones (2,400 W) • Integrated vacuum pipette for component removal and placement • Highly accurate placement with integrated force sensor • Enhanced Visual Assistant (EVA) • Computer aided component placement • Process control and documentation via software HRSoft 2 • Suitable for the use of the Dip&Print Station • Dimensions (W x D x H) in mm: 573 x 765 x 545/747 (heating head down/up) • Weight in kg: 76 • Antistatic Design (y/n): yes • Power Rating in W: 4.200 • Nominal voltage in V AC: 230 • Upper heating: Hybrid emitter (900 + 900 W), 70 x 70 mm • Lower heating: IR emitter (3 x 800 W), 390 x 270 mm • PCB size in mm: up to 400 x 300 mm (+x) up to 520 x 360 mm (+x) (0HR550L) • Component size in mm: from 01005 to 70 x 70 • Operation: Windows-PC • Test symbol: CE • Option: Reflow process camera: 2,3 MP, CMOS GigE color camera, 25 mm focal length, illumination 2x LED, adjustable
Технические характеристики
CharacteristicsOperational modeautomatic
