High-power electronic assemblies, such as those used in drive technology or frequency inverters, must be cooled to protect the power semiconductors against overheating and failure. Our application-specific high-performance heat sinks provide a typical cooling solution for this requirement. Combined with a fan for forced cooling, the very compact and high-performance heat sinks are an inexpensive alternative to liquid cooling systems. Many high-performance heat sinks have a modular design. The heat sink base and cooling fins are either bonded, cold welded or brazed. Other typical manufacturing processes are press-fitting of the cooling fins in the base (crimped fins), paring of the fins from a metal block (skived fins), cold extrusion and friction stir welding. Which process is used is determined on the basis of the particular application: required cooling capacity, available installation space and the number of heat sinks to be manufactured. Here you can learn more about our production processes!! Basic advantages of high-performance heat sinks Application-specific solutions Efficient and compact Direct contact with the electronic component Extremely effective heat dissipation Ideal for fan-supported cooling High-performance heat sink with modular design The modular design allows the configuration of individual heat sinks with high fin density and long cooling fins on the basis of pre-fabricated standard modules. Three processes are used for joining the single elements to create a high-performance heat sink: brazing, friction stir welding and crimping. The advantages of modular high-performance heat sinks at a glance
Технические характеристики
CharacteristicsMaterialaluminumOptionsextruded, power, compact, custom
