ZYGO®’s APM650™ packaging metrology system is a new inspection tool designed for automated measurement of panel-based PCBs and other modern packaging applications. It offers 2D and 3D measurements for several surface features, with sub-nanometer vertical precision and sub-micron lateral precision At the core of the APM650™ system, Coherence Scanning Interferometry (CSI) is the measurement technology. This non-contact technique offers high-precision and high-value surface metrology benefits, including: — Sub-nanometer measurement precision is independent of field magnification — Measures nearly all types of surfaces, from rough to exremely smooth, such as thin films, steep slopes, and large steps — SureScan™ vibration tolerance technology — strong operation in almost any environment — Gage capable performance — outstanding precision and repeatability for highly challenging production applications — Mx™ software enables seamless data exchange with other ZYGO® Profilers, including Nexview™, ZeGage™, and NewView™ 8000
Технические характеристики
CharacteristicsTechnology3D, optical, white light interferometryFunctionroughness, flatnessApplicationsindustrial, for production lines, laboratoryOther characteristicsnon-contact, non-destructive
